This article reports the effect of addition of small amount of thiourea on mechanism of film growth, levelling and grain refinement of pulsed electrodeposition of nanocrystalline copper on stainless steel substrate using simple aqueous acidic copper sulphate solution prepared from .25 M CuSO4·5H2O and .5 M H2SO4. The amount of thiourea used in the electrolyte is and 36 mg/l. The results indicate the change in morphology of the deposits with addition of thiourea leading to dendrite free copper deposits. The growth mechanism of the copper deposition is found to change from Volmer–Weber type to Frank-Vander Merwe type making the deposits smoother when deposited with thiourea addition. A small amount (36 mg/l) of thiourea addition leads to decrease in the average grain size of copper from 116 nm to 14 nm. The results clearly reveal the formation of nanocrystalline copper by addition of thiourea with three orders of magnitude reduction in grain size as compared to the sample deposited without thiourea. Preferential segregation of sulphur (present in thiourea) along the grain boundaries of nanocrystalline copper is shown by energy filter imaging using ultra high resolution transmission electron microscope (TEM), thereby restricting the growth of copper grains during pulsed electrodeposition.
Related Content
Mesoscopic Ni particles and nanowires by pulsed electrodeposition into porous Si
We report in this article on the formation of mesoscopic Ni particles and filling of continuous Ni nanowires into porous Si layers of thickness in the range of 0.5–4 μm with anisotropic vertical pores of average diameter in the range of 30–45 nm using pulsed electrodeposition from a Ni sal...


Modulation of Crystallographic Texture and Twinning Structure of Cu Nanowires by Electrodeposition
Variation of crystallographic growth direction and twinning structure of Cu nanowires (NWs) is achieved by a pulsed-current deposition method with anodic aluminum oxide templates. With increasing applied current density and decreasing deposition temperature, the grown Cu NWs showed an enhancement...
Refinement of electrodeposition mechanism for fabrication of thin nickel films on n-type silicon (111)
Electrodeposition of nickel on n-type silicon surface from sulfate, sulfate-chloride and Watts solutions has been investigated. Cyclic voltammograms obtained from different solutions reveal that nickel reduction is influenced by hydrogen evolution, adsorption of chloride ions and concentration of...


CVD diamond film deposited on copper substrate enhanced by a thin platinum modification layer
By coating a platinum layer of about 40 nm thickness to a copper substrate seeded with ultradispersed nanodiamond particles (UDDs), faceted diamond with high density was detected. It presents a novel nucleation mechanism – carbon in UDDs was dissolved in platinum and was transferred through t...
Characterization of glucose electro-oxidation at Ni and Ni-Cr alloy electrodes
Electro catalytic oxidation of glucose by the nickel oxy-hydroxide film developed in alkaline medium on different working electrodes materials (Ni, Ni-Cr (90:10) or Ni-Cr (80:20)) is demonstrated. In the presence of glucose the oxidation peak current of nickel hydroxide increases while that of th...

The initial transient of natural convection during copper electrolysis in the presence of an opposing Lorentz force: Current dependence
Magnetic fields are well-established in electrochemistry as an attractive tool to improve both the quality of the deposit as well as the deposition rate. The key mechanism is a mass transfer enhancement by Lorentz-force-driven convection. However, during electrolysis this convection interacts wit...
Morphology control of CuO micro-particles using Zn2+ ion and ultrasonic treatment
Novel tomato-shaped copper oxide crystals has been prepared by a simple hydrothermal method with the presence of Zn2+ ion. The ultrasonic pretreatment has proved to be the key factor during the synthesis process. Scanning electron microscope, energy dispersive X-ray spectrometry and powder X-ray ...

Electrical and magnetoelectronic properties of La.7Sr.3MnO3/SiO2/p-Si heterostructure for spintronics application
An experimental study of p-silicon (Si)/La.7Sr.3MnO3(LSMO) junction in which the LSMO and silicon are separated by a thin interfacial silicon dioxide (SiO2) layer has been fabricated. Two type of SiO2layer has been discussed here – one is native oxide and another one is thermal oxide. The therm...
Comparison of Flux Pinning Mechanism in Laser Ablated YBCO and YBCO:BaZrO3 Nanocomposite Thin Films
Thin films of YBCO and YBCO:BaZrO3 (BZO) nanocomposite have been deposited using the pulsed laser deposition technique. Substantial increase in critical current density (JC) and pinning force density (Fp) of the nanocomposite thin films was observed. The possible pinning mechanism in YBCO:BZO nan...

Controllable Formation of Particulates and the Effects on Superconductivity of La1.85Sr.15CuO4 Film Grown by the Pulsed Electron Deposition Method
During the growth of La1.85Sr.15CuO4 (LSCO) film by pulsed electron deposition, the formation of surface particulates shows a strong dependence on several key factors, such as the substrate, the deposition pressure (P), and the accelerating potential (AP). The size of the particulates can be cont...